Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding
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چکیده
منابع مشابه
Direct wafer bonding for MEMS and microelectronics
Direct wafer bonding is a method for fabricating advanced substrates for microelectromechanical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer. SOI wafers offer many advantages over conventional silicon wafers. In IC technology, the switching speed of circuits fabricated on SOI is increased by 20-50% co...
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تاریخ انتشار 2005